Impact of Integration Parameters on Inference Accuracy," in IEEE Transactions on Electron Devices (TED), 2022, doi: 10.1109/TED.2022.3231570. [2] Y. Zhang, Y. Zhang, and M. S. Bakir, “Thermal design ...
The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling ...
A novel fabrication process enables the near junction integration of VC which not only acts as heat spreaders but also conducts the drain current of MOSFETs. The thermal impedance analysis in the ...
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