Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) for at least the next year based on design ...

Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S. Due to these changes, certain ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

In the US, you can pick up an RTX 5090 FE from Best Buy for $2,000. In the UK, you can pick one up straight from Nvidia ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...