It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to new heights.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

The facility’s opening will bolster Micron’s technological edge and solidify SG’s position as a critical player in the global ...

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company announced the investment on the same day it broke ground on a new ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM ...

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

An array of chipmakers are ramping up chip output in Southeast Asia. Last week, Micron announced a US$7 billion plan to make ...

A US$7 billion Micron advanced packaging facility in Singapore will help manufacture high-bandwidth memory (HBM) chips in ...

The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...

We recently compiled a list of the 12 Most Undervalued Tech Stocks to Invest in Now. In this article, we are going to take a ...

Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...