Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...

Changing its Blackwell architectural plan, Nvidia ( NVDA, Financials) is reordering its product line and supply chain focus.

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...

CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are ...

Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

Jensen Huang, CEO of Nvidia, who visited Taiwan, stated that the demand for advanced packaging (CoWoS) from TSMC is rapidly ...