Bartronics India Ltd and PTW Group from Singapore have signed an MoU to strengthen India’s semiconductor industry through a ...
The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.
Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.
Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...
Micron Technology (NASDAQ:MU) said on Wednesday that it broke ground on a new High-Bandwidth Memory, or HBM, advanced ...
Bartronics India, a leading Fin-tech business solution provider delivering cutting edge technology solutions to enterprises and PTW Group, a Singapore based semiconductor solutions provider have ...
Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.
Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.
Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...